[share_ebook] Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
ISBN: 0750672188
Category: Technical
Tag: Embedded Systems
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Posted on 2011-10-15, by rosea.
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[b]Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies[/b]
280 pages | Sep 22 2010 |ISBN: 0750672188 | PDF | 5.5 Mb[/center]
[/img][b]Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies[/b]
280 pages | Sep 22 2010 |ISBN: 0750672188 | PDF | 5.5 Mb[/center]
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.
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