[share_ebook] Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

ISBN: 0750672188

Category: Technical

Tag: Embedded Systems


Posted on 2011-10-15, by rosea.

Description


Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
280 pages | Sep 22 2010 |ISBN: 0750672188 | PDF | 5.5 Mb
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.

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