[share_ebook] Materials for High-Density Electronic Packaging and Interconnection by Committee on Materials for High-Density Electronic


Author: Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Resear

Date: 1990-01-01

ISBN: 030904233X

Pages: 156

Language: English

Publisher: National Academies Press

Category: Technical

Tag: Multimedia


Posted on 2011-10-28, by LionFar.

Description


Title:Materials for High-Density Electronic Packaging and Interconnection by Committee on Materials for High-Density Electronic
Author:Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council
Publisher:National Academies Press
ISBN:030904233X
ISBN13:
Date1990-01-01
Pages:156
Language:English
Format: PDF
Size:6.43 MB

Description:no descriptin


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